• Plasma Technology.
  • PVD Sputtering, Evaporation Joule and E_Beam, Ion_Beam Sputtering. (Phisical Vapor Deposition).
  • Thermal CVD, MicroWave CVD, Hot Filament CVD (Chemical Vapor Deposition).
  • PLD (Pulsed Laser Deposition).
  • ICP_PECVD Plasma Enhanced PECVD.
  • R.I.E. (Reactive Ion Etching), ICP RIE.
  • Substrates Heaters.
  • DC and RF Bias Voltage Substrates.
  • Cryogenics System.
  • Process Gas, Mass Flow Meter, High Purity Technology.

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